The soldering process of surface mount integrated circuits

The soldering process of SMT integrated circuits is as follows:
① Use an electric soldering iron to level the solder joints on the circuit board. If necessary, touch up the solder joints with less solder, and then clean the impurities around the solder joints with alcohol.
② Align the integrated circuit to be welded with the welding position on the circuit board, then weld the four pins of the diagonal of the integrated circuit with an electric soldering iron, fix the integrated circuit, and coat the pins with rosin perfume or some rosin powder.

③ If using a hot air gun for soldering, the pins around the integrated circuit can be blown and soldered with the hot air gun. After the solder on the circuit board solder joints melts, remove the hot air gun and the pins will stick together with the circuit board solder joints. If using an electric soldering iron for soldering, a small amount of solder can be applied to the tip of the iron, and then dragged on a column of pins. The solder will stick each pin to the solder joint on the circuit board. If some pins of the integrated circuit are short circuited by the solder connection, you can first use multiple strands of copper wires to absorb the excess solder, then apply loose perfume on the spot, heat the spot with an electric soldering iron, and the remaining solder between the pins will automatically disconnect and return to the pins.

④ After welding is completed, check for short circuits or solder leaks between the pins of the integrated circuit. During the inspection, use a magnifying glass or multimeter to check. If there is a solder leak, use a pointed soldering iron to repair it. Finally, clean the rosin around the integrated circuit with anhydrous alcohol.