Device failure refers to the complete or partial loss of function, parameter drift, or intermittent occurrence of the above situations. The failure mode
is the external macroscopic manifestation of product failure, including open circuit, short circuit, intermittent disconnection, functional abnormalities,
parameter drift, etc. According to the failure mechanism. Failure can be divided into structural failure, thermal failure, electrical failure, corrosion failure,
etc. Failure analysis method:

(1) Non destructive analysis: X-ray fluoroscopy, ultrasonic scanning, electrical performance testing, morphology testing, local component analysis

(2) Destructive analysis: opening inspection, profile analysis, probe testing, thermal performance testing, overall composition testing, etc